How we work / Forward-deployed engineering

Thermal modeling,
design and testing.

Our engineers work with your team on heat-transfer and fluid-flow problems. We develop models, compare cooling designs and test prototypes under agreed operating conditions.

01

Physics-based simulation

Inputs: geometry, material properties, heat loads, boundary conditions and operating requirements.

Conceptual nested isotherms around a localized thermal gradient
∇TTemperature gradientLOCAL HEAT FLUX

Outputs: steady-state and transient fields, comparative designs, sensitivities and a clearer view of thermal limits.

Simulation-aided engineering
Technical evidence & conditions

Our modeling foundation spans eleven solver families: passive two-phase devices, chip-level thermal models, heat exchangers and active systems. Our ASME InterPACK paper compares the thermosyphon simulator with independent Nokia Bell Labs data—connecting model development to experimental evidence.

Read the supporting publication
02

Application-specific architectures

Inputs: heat flux distribution, packaging, coolant compatibility, pumping budget and manufacturing constraints.

Conceptual teal-to-amber transport streamlines
qThermal transportENERGY IN MOTION

Outputs: loop thermosyphon, pulsating heat pipe or compact refrigeration concepts, with design choices linked to physical requirements.

Technical evidence & conditions

We engineer loop thermosyphons, pulsating heat pipes and compact refrigeration. Our aluminum PHP prototype was tested at 2.8 kW. The 5 kW cold-plate concept is a numerical design awaiting prototype validation. The 2021 IEEE design study describes a buoyancy-driven fluid loop with an air-cooled condenser that still consumes fan power.

Read the supporting publication
03

Experimental validation

Inputs: an engineered prototype, calibrated instruments, test conditions and acceptance criteria.

Conceptual thermodynamic phase boundary and operating point
ΔTPhase spaceOPERATING ENVELOPE

Outputs: measured performance, model correlation, qualification evidence and manufacturing-transfer support.

Technical evidence & conditions

The companion IEEE experiment tested a 66 mm-high thermosyphon with a heated copper pseudo-CPU. R1233zd(E) tests covered 100–700 W; reported mean and maximum solver junction-temperature errors were 2.1 K and 5.8 K. These are test-specific results.

Read the supporting publication
The next step

Discuss your project
with our engineers.

Tell us what you are building and where you need help.

Talk to our team