Our work includes CPU cooling, power-system engineering, software licensing and research into thermal management for hybrid aircraft propulsion.
CPU cooling, power-system engineering, software licensing and heat recovery.
A custom loop thermosyphon architecture for CPU cooling.
Client identity is withheld. Fabrication, testing and approval are reported by JJ Cooling; no customer-specific power rating, production deployment or hyperscale status is established here.
Thermal engineering for Hitachi Energy across repeat programmes.
The available record confirms repeat programs, not a quantified efficiency gain or a specific customer test result.
Bosch licenses our specialist simulation software.
The available record does not establish licensed scope, customer performance or audited revenue.
A cooling and heat-recovery pilot.
Delivery is under way; a completed pilot acceptance or measured energy-recovery benefit is not reported.
Edge-computing tests, independent measurements and European aerospace research.
A gravity-driven loop thermosyphon connects a compact node-cooling monoblock to an air-cooled condenser.
The BRAINE project’s edge-computing cooling architecture is documented in ASME InterPACK research. A companion IEEE paper reports thermal performance tests at TU/e. The fluid loop is passive; condenser fans can consume power. These are testbed studies, not a general datacenter efficiency guarantee.
Read the public sourceOur thermosyphon simulator was compared with independent server-cooling measurements from Nokia Bell Labs.
ASME InterPACK 2020 reports good agreement for the studied dataset. This is model validation against independent measurements, not a Nokia customer engagement, endorsement or claim that JJ Cooling fabricated the measured hardware.
Read the public source
Pulsating-heat-pipe modeling, fabrication and experimental validation for aircraft propulsion thermal management.
The European Commission’s PHP2 record identifies JJ Cooling as a participant in research on pulsating heat pipes for hybrid propulsion. Participation is not flight qualification, a certified product or evidence of a named aerospace customer deployment.
Read the public sourceHigh heat flux, compact packaging and demanding operating conditions.
Local hotspots, concentrated heat flux and controlled hot-test temperatures.
Simulate spatial heat maps, coolant paths and load steps. Our company-reported 5 kW cold-plate concept is a numerical design—not qualified 5 kW chip hardware.
Junction or device temperature, spatial uniformity, thermal resistance, pressure drop and sustained usable power.
Design requirementsAgree temperature limits, available space and operating conditions before selecting a design.
Thermal cycling, uneven module temperatures and system-level cooling losses.
Tailor thermal paths to power modules and duty cycles. Our company-reported test documents a 2.8 kW aluminum PHP, with 85 °C device temperature and 40 °C / 20 °C cooling-water conditions.
Peak temperature, module-to-module uniformity, auxiliary power and performance over duty cycles.
Design requirementsAgree temperature limits, available space and operating conditions before selecting a design.
Restricted space and weight, variable environments and demanding reliability requirements.
Compare architectures against packaging and environmental constraints; correlate models with rigorous test conditions.
Temperature margins, mass, volume, environmental operating range and qualification criteria.
Design requirementsAgree temperature limits, available space and operating conditions before selecting a design.
We can assess cooling requirements for lasers, scientific instruments and other compact electronics. Tell us the heat load, temperature limits and available space.
Discuss your applicationTell us what you are building and where you need help.
